Nvidia’s use of TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging for its new Blackwell platform products has led to the Taiwanese manufacturer ramping up its production capacity for 2024. Nvidia’s latest Blackwell platform products include the new B200 GPU (Graphics Processing Unit) and the GB200, which integrates the Grace CPU (Central Processing Unit), and all use high-precision CoWoS packaging from TSMC. CoWoS packaging is a technology that integrates multiple chips on a single substrate to improve performance and efficiency in semiconductor devices. The GB200 is expected to ship more than one million units in 2025, representing around 40% to 50% of Nvidia’s high-end GPU shipments, according to supply chain sources. TSMC is currently increasing its CoWoS production capacity, with estimated monthly capacity expected to near 40,000 units by the end of the year, an increase of over 150% compared to 2023. [Icsmart, in Chinese]